Ordtech’s versatile manufacturing area is set up primarily for small lot production and is equipped to produce a wide range of products. Assembly area includes facilities for support processes such as graphics, silkscreen marking, conformal coating and encapsulation as well as metal fabrication and machining capabilities. All operations are performed in accordance with strict military specifications.
When obsolete items cannot be procured, Ordtech’s experienced engineering staff can either reverse-engineer the obsolete item or produce own design using state-of-the-art technology that will meet or exceed all requirements of the original manufacturer’s specifications. Design prototypes are subjected to rigorous functional and environmental testing to ensure dependable operation upon deployment to the field. Ordtech also has the capability to generate complete documentation for own designs including stable base artwork and electrical schematics, as well as detailed manufacturing and test procedures.
Total Quality Output is simply fundamental. All assembled products are meticulously inspected by both the operator in manufacturing as well as a Quality Assurance inspectror at each stage of the manufacturing process. All orders for individual items, regardless of size, must pass stringent inspection requirements outlined by QA department before being shipped to Customers. Testing facilities incorporate a wide range of modern test equipment and fixtures as well as x-ray and environmental test capabilities to ensure the level of Quality which Customers demand. All Quality processes are in full accordance with MIL-I-45208 (ISO9002) and MIL-STD-45662 (ISO10012-1).
Ordtech Electronics produces a wide range of Cable Assemblies including High Voltage Cables, RF Signal Cables, and Molded Cable Assemblies. Range of capabilities includes laying-out and fabrication of small, intricate Wiring Harnesses as well as the larger, more complex harnesses with several breakouts. Programmable automated test equipment is used to ensure correct wire placement and proper continuity after assembly.
|Circuit Card Assemblies
Ordtech Electronics manufactures single and multi-layer Circuit Card Assemblies of superior quality. All are assembled and inspected in accordance with MIL-STD-2000 requirements and are hand-soldered to ensure exact solder flow at a level of workmanship, unmatched by machine. Specialized test fixtures are designed and constructed to ensure all boards meet the specific requirements of assembly drawing as well as test specifications or supplementary drawings referenced by that assembly.
Ordtech Electronics produces sophisticated wire-wrap panels that require automated testing as the electrical signals are being processed at speeds that prevent measurement by hand. Ordtech has designed a complex computerized test set-up that records all measurements and isolates failures quickly and accurately. Additionally, Ordtech has the equipment to program and verify the PAL, PROM and EPROM microcircuits that are often required for panel assemblies.
Ordtech Electronics manufactures a wide range of complicated Chassis Assemblies including Power Supplies, Missile System Test Equipment, Consoles and Interface Equipment. Chassis Assemblies, Mechanical Assemblies and Wiring Harnesses assembled together into a metal enclosure. Each individual item is fully inspected and tested before becoming a component part of the next higher assembly, thus ensuring a quality finished product.